| 型号 | 品牌 | 描述 | 封装 | 库存 | 操作 |
|---|---|---|---|---|---|
| C650-100-WH | Bourns Inc. | 3-SMD, No Lead | — | 申请询价 | |
| C650-180-WH | Bourns Inc. | 3-SMD, No Lead | — | 申请询价 | |
| C650-260-WH | Bourns Inc. | 3-SMD, No Lead | — | 申请询价 | |
| C850-100-WH | Bourns Inc. | 3-SMD, No Lead | — | 申请询价 | |
| C850-260-WH | Bourns Inc. | 3-SMD, No Lead | — | 申请询价 | |
| DPO2039DABQ-13 | Diodes Incorporated | 16-UFQFN Exposed Pad | — | 申请询价 | |
| NX20P0408UKZ | NXP USA Inc. | 12-UFBGA, WLCSP | — | ||
| NXP USA Inc. | 9-UFBGA, WLCSP | — | |||
| STMicroelectronics | 13-UFBGA, WLCSP | — | |||
| Bourns Inc. | 6-SMD, No Lead | — | |||
| Bourns Inc. | 6-SMD, No Lead | — | |||
| Bourns Inc. | 6-SMD, No Lead | — | |||
| STMicroelectronics | 8-WFDFN Exposed Pad | — | |||
| STMicroelectronics | 8-WFDFN Exposed Pad | — | |||
| STMicroelectronics | 8-WFDFN Exposed Pad | — | |||
| STMicroelectronics | 8-WFDFN Exposed Pad | — | |||
| Bourns Inc. | SMD 6.50mm x 4.00mm | — | |||
| Bourns Inc. | 3-SMD, No Lead | — | |||
| Bourns Inc. | SMD 6.50mm x 4.00mm | — | |||
| Bourns Inc. | SMD 6.50mm x 4.00mm | — |